Highly accurate wafer edge grinding example | Edge Shaping ...
Edge Grinding of Silicon Wafer. Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology. It is capable with as-cut wafer, lapped wafer and etched wafer. Wafer Size: 2″ to 18″. Shrinking of wafer size such as 12″ ・ 8″ or 4″ ・ 3″ is also possible.
